Specific Process Knowledge/Thin film deposition/Deposition of Tungsten: Difference between revisions

@@ Line 12: / Line 12: @@
 |-
 |-style="background:WhiteSmoke; color:black"
-! Batch size
+! General description
-|
+| E-beam evaporation of W
-*Up to 1x4" wafers
-*smaller pieces
 |-
 |-style="background:Lightgrey; color:black"
@@ Line 30: / Line 28: @@
 ! Deposition rate
 |2Å/s to 15Å/s
+|-
+|-style="background:WhiteSmoke; color:black"
+! Batch size
+|
+*Up to 1x4" wafers
+*smaller pieces
 |-
-|-style="background:WhiteSmoke; color:black"
+|-style="background:Lightgrey; color:black"
 ! Allowed materials
@@ Line 45: / Line 49: @@
 * Metals
-|-style="background:Lightgrey; color:black"
+|-style="background:WhiteSmoke; color:black"
 ! Comments
 |