Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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! General description | |||
|E-beam deposition of Cu | |||
|Sputter deposition of Cu | |||
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Depending on [[Specific Process Knowledge/Thin film deposition/Multisource PVD/Cu|process parameters]] | Depending on [[Specific Process Knowledge/Thin film deposition/Multisource PVD/Cu|process parameters]] | ||
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! Batch size | |||
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*Up to 1x4" wafers | |||
*smaller pieces | |||
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* 4x6" wafers or | |||
* 12x4" wafers or | |||
* 12x2" wafers | |||
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!Allowed materials | !Allowed materials | ||
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* SU-8 | * SU-8 | ||
* Metals | * Metals | ||
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! Comment | ! Comment | ||
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'''*''' ''To deposit layers thicker then 200 nm permission is required (contact Thin film group)'' | '''*''' ''To deposit layers thicker then 200 nm permission is required (contact Thin film group)'' | ||
== Studies of Cu deposition processes == | == Studies of Cu deposition processes == | ||