Specific Process Knowledge/Etch/Etching of Gold: Difference between revisions
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|Chemical solution | |Chemical solution | ||
|KJ:J<math>_2</math>:H<math>_2</math>O | |KJ:J<math>_2</math>:H<math>_2</math>O (100g:25g:500ml) | ||
|HCl:HNO<math>_3</math> (3:1) | |HCl:HNO<math>_3</math> (3:1) | ||
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|Process temperature | |Process temperature |
Revision as of 15:20, 18 January 2008
Etching of Gold
Etching of Gold is done wet at Danchip making your own set up in a beaker in the fumehood. We have two different solutions:
- Iodine etch: KI:I:HO - 400g:100g:400ml?
- Aqua Regia (Kongevand): HNO:HCl - 1:3
Comparing the two solutions
Iodine based gold etch | Aqua Regia (Kongevand) | |
---|---|---|
General description |
Etch of pure Gold |
Etch of pure Gold |
Chemical solution | KJ:J:HO (100g:25g:500ml) | HCl:HNO (3:1) |
Process temperature | 20 oC | 20 oC |
Possible masking materials: |
Photoresist (1.5 µm AZ5214E) |
Photoresist (1.5 µm AZ5214E) |
Etch rate |
~100 nm/min (Pure Al) |
~(??) nm/min |
Batch size |
1-25 wafers at a time |
1-25 wafer at a time |
Size of substrate |
2-6" wafers |
2-6" wafers |