Specific Process Knowledge/Etch/Etching of Gold: Difference between revisions

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2-6" wafers
2-6" wafers
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|Allowed materials
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*Aluminium
*Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Photoresist
*E-beam resist
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*Aluminium
*Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Photoresist
*E-beam resist
|-
|}

Revision as of 15:15, 18 January 2008

Etching of Gold

Etching of Gold is done wet at Danchip making your own set up in the fumehood. We have two different solutions:

  1. Iodine etch: KI:I:HO - 400g:100g:400ml?
  2. Aqua Regia (Kongevand): HNO:HCl - 1:3


Comparing the two solutions

Iodine based gold etch Aqua Regia (Kongevand)
General description

Etch of pure Gold

Etch of pure Gold

Chemical solution KJ:J:HO (100g:25g:500ml) H:HO (3:1)
Process temperature 20 oC 20 oC
Possible masking materials:

Photoresist (1.5 µm AZ5214E)

Photoresist (1.5 µm AZ5214E)

Etch rate

~100 nm/min (Pure Al)

~(??) nm/min

Batch size

1-25 wafers at a time

1-25 wafer at a time

Size of substrate

2-6" wafers

2-6" wafers