Specific Process Knowledge/Etch/Etching of Gold: Difference between revisions
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|Chemical solution | |Chemical solution | ||
|KJ:J<math>_2</math>:H<math>_2</math>O 100g:25g:500ml | |KJ:J<math>_2</math>:H<math>_2</math>O 100g:25g:500ml | ||
|H<math>Cl</math>:H<math>N</math> | |H<math>Cl</math>:H<math>N</math>O3 | ||
|- | |- | ||
|Process temperature | |Process temperature |
Revision as of 15:02, 18 January 2008
Etching of Gold
Etching of Gold is done wet at Danchip. We have two different solutions:
- KI:IFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} :HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O - 400g:100g:400ml?
- HNOFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _3} :HCl - 1:3
Comparing the two solutions
Iodine based gold etch | Aqua Regia (Kongevand) | |
---|---|---|
General description |
Etch of pure Gold |
Etch of pure Gold |
Chemical solution | KJ:JFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} :HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O 100g:25g:500ml | HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle Cl} :HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle N} O3 |
Process temperature | 20 oC | 20 oC |
Possible masking materials: |
Photoresist (1.5 µm AZ5214E) |
Photoresist (1.5 µm AZ5214E) |
Etch rate |
~100 nm/min (Pure Al) |
~60(??) nm/min |
Batch size |
1-25 wafers at a time |
1-25 wafer at a time |
Size of substrate |
4" wafers |
4" wafers |
Allowed materials |
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