Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300: Difference between revisions
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*Typical within +-2% | *Typical within +-2% | ||
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!style="background:silver; color:black" align="left" valign="top" rowspan=" | !style="background:silver; color:black" align="left" valign="top" rowspan="3"|Process parameters | ||
|style="background:LightGrey; color:black"|Gas flows | |style="background:LightGrey; color:black"|Gas flows | ||
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*0-60 degrees Celcius | *0-60 degrees Celcius | ||
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|style="background:LightGrey; color:black"|Platen temperature | |||
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*5-60 degrees Celcius | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates | !style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Batch size | |style="background:LightGrey; color:black"|Batch size | ||