Specific Process Knowledge/Thermal Process/Oxidation: Difference between revisions
| Line 163: | Line 163: | ||
| | | | ||
All wafers have to be RCA cleaned. | All wafers have to be RCA cleaned. | ||
Except for wafers from EVG-NIL, PECVD3 and wafer | Except for wafers from EVG-NIL, PECVD3 and wafer with aluminum. | ||
| | | | ||
Only new wafers | Only new wafers | ||