Specific Process Knowledge/Etch/Etching of Gold

Etching of Gold

Etching of Gold is done wet at Danchip. We have two different solutions:

1. KI:I${}_2$:H${}_2$O - 400g:100g:400ml?
2. HNO${}_3$:HCl - 1:3

Comparing the two solutions

	Iodine based gold etch	Aqua Regia (Kongevand)
General description	Etch of pure Gold	Etch of pure Gold
Chemical solution	KJ:J${}_2$:H${}_2$O 100g:25g:500ml
Process temperature	20 oC	20 oC
Possible masking materials:	Photoresist (1.5 µm AZ5214E)	Photoresist (1.5 µm AZ5214E)
Etch rate	~100 nm/min (Pure Al)	~60(??) nm/min
Batch size	1-25 wafers at a time	1-25 wafer at a time
Size of substrate	4" wafers	4" wafers
Allowed materials	Aluminium Silicon Silicon Oxide Silicon Nitride Silicon Oxynitride Photoresist E-beam resist	Aluminium Silicon Silicon Oxide Silicon Nitride Silicon Oxynitride Photoresist E-beam resist