Specific Process Knowledge/Lithography/Baking: Difference between revisions
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==110 C 4" hotplate== | ==110 C 4" hotplate== | ||
[[Image: | [[Image:Hotplate_120_degrees_cr3.jpg|200x200px|thumb|Hotplate 110 degrees: positioned in C-1]] | ||
The 110 °C hotplate is used for 2 different things; hard bake of resist, and image reversal baking between two exposures. It is recommended to hard bake for 2 min. For image reversal it is recommended to bake at least 100 sec., some bake for 120 sec. | The 110 °C hotplate is used for 2 different things; hard bake of resist, and image reversal baking between two exposures. It is recommended to hard bake for 2 min. For image reversal it is recommended to bake at least 100 sec., some bake for 120 sec. | ||
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==SU8 hotplates== | ==SU8 hotplates== | ||