Specific Process Knowledge/Thin film deposition/Deposition of Silicon: Difference between revisions
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! | ! | ||
! Sputter ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! Sputter ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
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| Batch size | |-style="background:WhiteSmoke; color:black" | ||
! Batch size | |||
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*Up to 1x4" wafers | *Up to 1x4" wafers | ||
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|. | |. | ||
|- | |- | ||
| Pre-clean | |-style="background:LightGrey; color:black" | ||
! Pre-clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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|- | |- | ||
| Layer thickness | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | |||
|10Å to 1µm | |10Å to 1µm | ||
|10Å to about 3000Å | |10Å to about 3000Å | ||
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| Deposition rate | |-style="background:LightGrey; color:black" | ||
! Deposition rate | |||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|Dependent on process parameters, but in the order of 1 Å/s. See more [[Specific Process Knowledge/Thin film deposition/Si sputter in PVD co-sputter/evaporation|here]] | |Dependent on process parameters, but in the order of 1 Å/s. See more [[Specific Process Knowledge/Thin film deposition/Si sputter in PVD co-sputter/evaporation|here]] | ||
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|Process temperature | |-style="background:WhiteSmoke; color:black" | ||
! Process temperature | |||
|? | |? | ||
| Option: heating wafer up to 400 deg C | | Option: heating wafer up to 400 deg C | ||
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|Step coverage | |-style="background:LightGrey; color:black" | ||
! Step coverage | |||
|Poor | |Poor | ||
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|Adhesion | |||
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! Adhesion | |||
|Bad for pyrex, for other materials we do not know | |Bad for pyrex, for other materials we do not know | ||
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|Pyrex | ! Allowed substrates | ||
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* Silicon | |||
* Pyrex | |||
* Fused silica, , metals, oxide, nitride, blue tape | |||
|Pyrex, fused silica, silicon, metals, oxide, nitride | |Pyrex, fused silica, silicon, metals, oxide, nitride | ||
|Fused silica, Silicon, oxide, nitride | |Fused silica, Silicon, oxide, nitride | ||
|Pyrex, fused silica, silicon, metals, oxide, nitride | |Pyrex, fused silica, silicon, metals, oxide, nitride | ||
|. | |. | ||
|- | |- | ||
|Doping facility | |-style="background:WhiteSmoke; color:black" | ||
! Allowed material | |||
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|-style="background:LightGrey; color:black" | |||
! Doping facility | |||
|None | |None | ||
|None | |None | ||