Jump to content

Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions

Kabi (talk | contribs)
Kabi (talk | contribs)
Line 193: Line 193:
*We are testing other masks at the moment (ask BGE)
*We are testing other masks at the moment (ask BGE)
|- valign="top"
|- valign="top"
|-
|-style="background:WhiteSmoke; color:black"
|'''Etch rate'''
|'''Etch rate'''
|
|
Line 200: Line 202:
*~3.9 µm/min   
*~3.9 µm/min   
|-valign="top"
|-valign="top"
|-
|-style="background:LightGrey; color:black"
|'''Uniformity'''
|'''Uniformity'''
|
|
Line 206: Line 210:
*   
*   
|-valign="top"
|-valign="top"
 
|-
|-style="background:WhiteSmoke; color:black"
|'''Batch size'''
|'''Batch size'''
|
|
Line 213: Line 218:
*1 wafer at a time
*1 wafer at a time
|-valign="top"
|-valign="top"
|-
|-style="background:LightGrey; color:black"
|'''Size of substrate'''
|'''Size of substrate'''
|
|
Line 219: Line 226:
*4" wafers
*4" wafers
|-valign="top"
|-valign="top"
|-
|-style="background:WhiteSmoke; color:black"
|'''Allowed materials'''
|'''Allowed materials'''
|
|