Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
| Line 177: | Line 177: | ||
| Easily break silicon in cristal plan. Depth of the groove : 25µm | | Easily break silicon in cristal plan. Depth of the groove : 25µm | ||
|- style="background:LightGray;text-align:center" valign="top" | |- style="background:LightGray;text-align:center" valign="top" | ||
| Silicon (525µm) + Si3N4 (150nm to 1,2µm) OR SiO2 (150nm to 320nm) | | Silicon (525µm) + Si3N4 (150nm up to 1,2µm) OR SiO2 (150nm up to 320nm) | ||
| Red (1064nm/255mm) | | Red (1064nm/255mm) | ||
| 200 kHz | | 200 kHz | ||