Specific Process Knowledge/Thermal Process/Oxidation: Difference between revisions
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!'''Allowed materials''' | !'''Allowed materials''' | ||
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*All wafers have to be RCA cleaned. Except for Boron pre-dep wafer from furnace A1. | *All wafers have to be RCA cleaned. | ||
Except for Boron pre-dep wafer from furnace A1. | |||
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*All wafers have to be RCA cleaned. | *All wafers have to be RCA cleaned. | ||
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*All wafers have to be RCA cleaned. Except for Phosphorous pre-dep wafers from furnace A4. | *All wafers have to be RCA cleaned. | ||
Except for Phosphorous pre-dep wafers from furnace A4. | |||
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*All processed wafers have to be RCA cleaned. Except for wafers from LPCVD furnace and PECVD1. | *All processed wafers have to be RCA cleaned. | ||
Except for wafers from LPCVD furnace and PECVD1. | |||
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*All wafers have to be RCA cleaned. Except for wafers from EVG-NIL and | *All wafers have to be RCA cleaned. | ||
Except for wafers from EVG-NIL, PECVD3 and wafer for annealing of aluminum. | |||
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Only new wafers | Only new wafers | ||