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Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions

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{| border="1" cellspacing="0" cellpadding="4"  
{| border="1" cellspacing="0" cellpadding="4"  
|-style="background:silver; color:black"
!  
!  
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
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! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
|-  
|-  
| Batch size
|-style="background:WhiteSmoke; color:black"
! Batch size
|
|
*Up to 1x4" wafers
*Up to 1x4" wafers
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*smaller pieces
*smaller pieces
|-
|-
| Pre-clean
|-style="background:LightGrey; color:black"
! Pre-clean
 
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
|-
|-
| Layer thickness
|-style="background:WhiteSmoke; color:black"
! Layer thickness
|10Å to 5000Å*  
|10Å to 5000Å*  
|10Å to 5000Å*
|10Å to 5000Å*
|10Å to 5000Å
|10Å to 5000Å
|-
|-
| Deposition rate
|-style="background:LightGrey; color:black"
! Deposition rate
|2Å/s to 15Å/s
|2Å/s to 15Å/s
|10Å/s to 15Å/s
|10Å/s to 15Å/s
|? Å/s to ? Å/s
|? Å/s to ? Å/s
|-
|-
|-style="background:WhiteSmoke; color:black"
!Allowed materials
|
* Silicon
* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
|
* Silicon
* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
|
* Silicon
* Silicon oxide
* Silicon nitride
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
* Carbon
|-style="background:LightGrey; color:black"
! Comment
|
|
|
|}
|}


'''*''' ''For thicknesses above 200 nm permission is required from Thin Film group.''
'''*''' ''For thicknesses above 200 nm permission is required from Thin Film group.''