Specific Process Knowledge/Wafer cleaning: Difference between revisions
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===Wafers that have been in the KOH baths, KOH BHF baths or the warm phosphoric acid=== <br/> | |||
Wafers that have been etched in KOH is often transferred directly to the warm phosphoric acid for nitride strip. Therefore wafers that have been in the KOH baths, KOH BHF baths or the warm phosphoric acid always need at minimum a 7-up or Piranha clean before they can be further processed. | Wafers that have been etched in KOH is often transferred directly to the warm phosphoric acid for nitride strip. Therefore wafers that have been in the KOH baths, KOH BHF baths or the warm phosphoric acid always need at minimum a 7-up or Piranha clean before they can be further processed. | ||
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===Items that have been outside the cleanroom=== <br/> | |||
Items that have been outside the cleanroom should always be cleaned in soap and ultra sound followed by a 7-up or Piranha clean before entering the cleanroom. | Items that have been outside the cleanroom should always be cleaned in soap and ultra sound followed by a 7-up or Piranha clean before entering the cleanroom. | ||
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===Masks=== <br/> | |||
Masks that have become dirty by dust particles or resist residues have to be cleaned in the 7-up (mask) bath before use. | Masks that have become dirty by dust particles or resist residues have to be cleaned in the 7-up (mask) bath before use. | ||
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