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Specific Process Knowledge/Thermal Process/Oxidation: Difference between revisions

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==Oxidation==
==Oxidation==
At Danchip we have six furnaces for oxidation: A1,A3,C1,C2,C3 and D1. Oxidation can take place either by a dry process or a wet process. The film quality of dry oxide is better than for wet oxide with regards to density and ?
At Danchip we have six furnaces for oxidation: A1,A3,C1,C2,C3 and D1. Oxidation can take place either by a dry process or a wet process. The film quality of dry oxide is better than for wet oxide with regards to density and dielectric constant.
If the film quality for the wet oxide is acceptable then the thickness and the time it takes to grow the oxide often decides if a dry or wet oxidation is chosen.
If the film quality for the wet oxide is acceptable then the thickness and the time it takes to grow the oxide often decides if a dry or wet oxidation is chosen.
*Dry oxide is used from 5nm - 200nm. Can be grown in furnaces:A1,A3,C1,C2,C3.
*Dry oxide is used from 5nm - 200nm. Can be grown in furnaces:A1,A3,C1,C2,C3.
*Wet oxide with O2 and H2 can be grown in furnace:A1,A3.
*Wet oxide with O2 and H2 can be grown in furnace:A1,A3.
*Wet oxide with H2O in a bobler can be grown in furnaces:C1,C2,C3.
*Wet oxide with H2O in a bobler can be grown in furnaces:C1,C2,C3.


==Comparing the six oxidation furnaces==
==Comparing the six oxidation furnaces==