Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
| Line 94: | Line 94: | ||
*Silicon | *Silicon | ||
*Polymers with Tg > 65°C | *Polymers with Tg > 65°C | ||
* | *Cross-linked or hard baked resists supported by one of the above two materials | ||
Seed metals:<br> | Seed metals:<br> | ||
* NiV (75 - 100 nm recommended) | * NiV (75 - 100 nm recommended) | ||