Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
| Line 93: | Line 93: | ||
Base materials:<br> | Base materials:<br> | ||
*Silicon | *Silicon | ||
*Polymers with Tg > | *Polymers with Tg > 65°C | ||
*One of the above two with cross-linked or hard baked resists | |||
Seed metals:<br> | Seed metals:<br> | ||
* NiV (75 - 100 nm recommended) | * NiV (75 - 100 nm recommended) | ||