Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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* 4x6" wafers or | * 4x6" wafers or | ||
* | * 12x4" wafers or | ||
* | * 12x2" wafers | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
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!Layer thickness | !Layer thickness | ||
|10Å to 0.5µm | |10Å to 0.5µm* | ||
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10Å to 1µm | 10Å to 1µm* | ||
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Depending on [[Specific Process Knowledge/Thin film deposition/Multisource PVD/Cu|process parameters]] | Depending on [[Specific Process Knowledge/Thin film deposition/Multisource PVD/Cu|process parameters]] | ||
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|-style="background:WhiteSmoke; color:black" | |||
!Allowed materials | |||
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* Silicon | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
| | |||
* Silicon | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
|-style="background:LightGrey; color:black" | |||
! Comment | |||
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|} | |} | ||
'''*''' ''To deposit layers thicker then 200 nm permission is required (contact Thin film group)'' | |||
== Studies of Cu deposition processes == | == Studies of Cu deposition processes == | ||