Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions
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!Film thickness | !Film thickness | ||
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*~300nm - 4µm | |||
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*~40nm - 30µm | |||
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*Thin layers (up to 300-400 nm) | |||
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*~10nm - ~1µm(>2h) | |||
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!Process Temperature | |||
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*725 <sup>o</sup>C | |||
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*300 <sup>o</sup>C | |||
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*Can be between room temp. and 400 <sup>o</sup>C | |||
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*Expected to be below 100<sup>o</sup>C | |||
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!2 | |||
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*~300nm - 4µm | |||
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*~40nm - 30µm | |||
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*Thin layers (up to 300-400 nm) | |||
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*~10nm - ~1µm(>2h) | |||
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!3 | |||
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*SiO<sub>2</sub> | |||
Can be doped with boron | |||
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*Si<sub>x</sub>O<sub>y</sub>H<sub>z</sub> | |||
Can be doped with boron, phosphorus or germanium | |||
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*Not measured (a sputter target with stoichiometry SiO<sub>2</sub> is used) | |||
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*Not measured (a sputter target with stoichiometry SiO<sub>2</sub> is used | |||
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!4 | |||
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*~300nm - 4µm | *~300nm - 4µm | ||