Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions

@@ Line 53: / Line 53: @@
 |Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]]
 |-
+|-style="background:WhiteSmoke; color:black"
+!Allowed materials
+|
+* Silicon
+* Silicon oxide
+* Silicon (oxy)nitride
+* Photoresist
+* PMMA
+* Mylar
+* SU-8
+* Metals
+|
+* Silicon
+* Silicon oxide
+* Silicon nitride
+* Silicon (oxy)nitride
+* Photoresist
+* PMMA
+* Mylar
+* SU-8
+|
+* Silicon
+* Silicon oxide
+* Silicon nitride
+* Silicon (oxy)nitride
+* Photoresist
+* PMMA
+* Mylar
+* SU-8
+|
+* Silicon
+* Silicon oxide
+* Silicon nitride
+* Silicon (oxy)nitride
+* Photoresist
+* PMMA
+* Mylar
+* SU-8
 |-
-|-style="background:WhiteSmoke; color:black"
+|-style="background:LightGrey;  color:black"
 ! Comment
 |