Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
No edit summary |
No edit summary |
||
| Line 55: | Line 55: | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Allowed materials | |||
| | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
| | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
| | |||
* Silicon | |||
* Silicon oxide | |||
* Silicon nitride | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
* Carbon | |||
|. | |||
|. | |||
|-style="background:LightGrey; color:black" | |||
! Comment | ! Comment | ||
|For thicknesses above 200 nm | |For thicknesses above 200 nm | ||