Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions
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! Sputter deposition (Wordentec) | ! Sputter deposition (Wordentec) | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Batch size | |||
| | | | ||
*24x2" wafers or | *24x2" wafers or | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Pre-clean | |||
|RF Ar clean | |RF Ar clean | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | |||
|. | |. | ||
|-style="background:LightGrey; color:black" | |||
| Deposition rate | |||
|-style="background:LightGrey; color:black" | |||
!Allowed materials | |||
| | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
|-style="background:WhiteSmoke; color:black" | |||
! Deposition rate | |||
|Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]] | |Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]] | ||
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