Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions
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*not Pb and very poisonous materials | *not Pb and very poisonous materials | ||
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![[Specific Process Knowledge/Thin film deposition/Furnace LPCVD TEOS|LPCVD(TEOS)]] | |||
![[Specific Process Knowledge/Thin film deposition/PECVD|PECVD]] | |||
![[Specific Process Knowledge/Thin film deposition/Deposition of Silicon oxide in PVD co-sputter/evaporation|PVD co-sputter/evaporation tool]] | |||
![[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab300]] | |||
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!Generel description | |||
|Generel description - method 1 | |||
|Generel description - method 2 | |||
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!Parameter 1 | |||
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*A | |||
*B | |||
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*A | |||
*B | |||
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!Parameter 2 | |||
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*A | |||
*B | |||
*C | |||
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*A | |||
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!Substrate size | |||
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*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
*<nowiki>#</nowiki> 100 mm wafers | |||
*<nowiki>#</nowiki> 150 mm wafers | |||
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*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
*<nowiki>#</nowiki> 100 mm wafers | |||
*<nowiki>#</nowiki> 150 mm wafers | |||
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!'''Allowed materials''' | |||
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*Allowed material 1 | |||
*Allowed material 2 | |||
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*Allowed material 1 | |||
*Allowed material 2 | |||
*Allowed material 3 | |||
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|} | |} | ||