Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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| Layer thickness | | Layer thickness | ||
|10 Å to 5000Å | |10 Å to 5000Å* | ||
|10 Å to 5000Å | |10 Å to 5000Å* | ||
|10 Å to | |10 Å to | ||
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'''*''' ''For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.'' | |||
== Adhesion of Au on Si == | == Adhesion of Au on Si == | ||
Revision as of 10:20, 5 March 2014
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Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | Sputter (Lesker) | Sputter coater Hummer | Sputter coater Balzer | |
|---|---|---|---|---|---|
| Batch size |
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| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | ||
| Layer thickness | 10 Å to 5000Å* | 10 Å to 5000Å* | 10 Å to | ||
| Deposition rate | 2 Å/s to 15 Å/s | 1 Å/s to 15 Å/s | Not measured | Not measured |
* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.
Adhesion of Au on Si
Studies of Au deposition processes
Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings