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Specific Process Knowledge/Wafer cleaning: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
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|Removes organics and alkali ions
|Removes organics and alkali ions
|Removing native oxide
|Removing native oxide
|Cleaning before wafer bonding
|Removes dust, organics and alkali ions and slightly polish the surface.
Removes dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic  
Make the surface hydrophillic  
|Removing dust and particles
|Removing dust and particles
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