Specific Process Knowledge/Wafer cleaning: Difference between revisions
| Line 29: | Line 29: | ||
|Removing native oxide | |Removing native oxide | ||
|Cleaning before wafer bonding | |Cleaning before wafer bonding | ||
Removes dust, organics and alkali ions and | Removes dust, organics and alkali ions and slightly polish the surface. | ||
Make the surface hydrophillic | Make the surface hydrophillic | ||
|Removing dust and particles | |Removing dust and particles | ||