Specific Process Knowledge/Wafer cleaning: Difference between revisions
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|Removing native oxide | |Removing native oxide | ||
|Cleaning before wafer bonding | |Cleaning before wafer bonding | ||
Removes dust, organics and alkali ions and slight polish of surface. | |||
Make the surface hydrophillic | |||
|Removing dust and particles | |Removing dust and particles | ||
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