Specific Process Knowledge/Wafer cleaning: Difference between revisions

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 '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning click here]'''
-== Clean with: ==
+== Cleaning of wafers ==
-*[[/RCA|RCA]] - ''Two step process to remove organics and metals''
-*[[/7-up & Piranha|7-up & Piranha]] - ''Removes organics and alkali ions''
-*[[/cleaning with HF|5% HF]] - ''Removing native oxide''
-*[[/IMEC|IMEC]] - ''Cleaning before fusion bonding''
-*[[/Cleaning with Soap Sonic|Soap Sonic]] - ''Cleaning of "dirty" wafers when entering the cleanroom''
+During processing it is sometimes necessary, mandatory or just recommended to clean the wafers. This can be done by different cleaning procedures depending on what the wafers have been exposed to where they are going to be further processed. Please consult the cross contamination scheme for to see whether your wafers need a cleaning before the next processing sequence.
 == [[Image:section under construction.jpg|70px]] Section under construction ==