Specific Process Knowledge/Wafer cleaning/7-up & Piranha: Difference between revisions

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==Cleaning of wafers or masks==
==Cleaning of wafers or masks==


Cleaning of wafers or masks with sulphuric acid can be done either in a dedicated tank "7-up" or in the fume hood in a beaker "Piranha"
Cleaning of wafers or masks with sulphuric acid can be done either in a dedicated tank "7-up" or in the fume hood in a beaker "Piranha".
Both 7-up and Piranha removes heavy organics.  
Both 7-up and Piranha removes heavy organics.  
Always use one of these after KOH etch or hot phosphoric acid etch to remove alkali ions before further processing. 7-up and Piranha are also used as cleaning solutions '''after''' stripping resist.
Always use one of these after KOH etch or hot phosphoric acid etch to remove alkali ions before further processing. 7-up and Piranha are also used as cleaning solutions '''after''' stripping resist.

Revision as of 11:14, 3 March 2014

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Cleaning of wafers or masks

Cleaning of wafers or masks with sulphuric acid can be done either in a dedicated tank "7-up" or in the fume hood in a beaker "Piranha". Both 7-up and Piranha removes heavy organics. Always use one of these after KOH etch or hot phosphoric acid etch to remove alkali ions before further processing. 7-up and Piranha are also used as cleaning solutions after stripping resist.

7-up 6" in cleanroom D3. <br\> -Up to 25 wafers of 4" or 6" at a time.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi
7-up for masks and glass wafers positioned in cleanroom D3:<br\> -Up to 25 glass wafers of 4" at a time or 4 masks.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi, glass, chromium
7-up 4": positioned in cleanroom C1<br\> -Up to 19 wafers of 4" at a time.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi

Comparing data for "7-up" and Piranha

7-up wafers 7-up Masks Piranha
General description

Cleaning of wafers using the dedicated tank in cleanroom D3.

Cleaning of masks using the dedicated tank in cleanroom D3.

Cleaning of wafers using a beaker in the fumehood in cleanroom B1. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the 7-up for wafers or masks.

Chemical solution 98% Sulfuric acid and Ammonium sulfate 98% Sulfuric acid and Ammonium sulfate 98% Sulfuric acid and Hydrogen peroxide 4:1 add H2O2 to H2SO4
Process temperature 80 oC 80 oC ~70 oC the chemicals will heat up to working temperature during mixing, therefore be careful!First ad H2SO4 then H2O2
Process time 10 min. 10 min. 10 min.
Allowed materials
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Quartz/fused silica
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Quartz/fused silica
  • Pyrex
  • Soda lime glass
  • Wafers with Cr

All materials (in beaker).

Batch size

1-25 4" or 6" wafers

1-25 4" or 6" wafers or 1-4 5" masks

1-5 4" wafer at a time

Size of substrate

4-6" wafers

4-6" wafers or 5" masks

All sizes that can fit into the beaker in a dedicated holder