Specific Process Knowledge/Wafer cleaning/7-up & Piranha: Difference between revisions

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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!  
!  
! "7-up"
! 7-up wafers
! 7-up Masks
! Piranha
! Piranha
|-  
|-  
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|'''General description'''
|'''General description'''
|
|
Cleaning of wafers or masks using the dedicated tanks. There are one tank for masks and glass wafers and one for 4-6" Si wafers in cleanroom D3 and one tank in cleanroom C1 for 4" Si wafers only.
Cleaning of wafers using the dedicated tank in cleanroom D3.  
|
|
Cleaning of wafers using a beaker in the fumehood in cleanroom B1. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the 7-up for wafers.
Cleaning of masks using the dedicated tank in cleanroom D3.
|
Cleaning of wafers using a beaker in the fumehood in cleanroom B1. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the 7-up for wafers or masks.
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
|'''Chemical solution'''
|'''Chemical solution'''
|98% Sulfuric acid and Ammonium sulfate
|98% Sulfuric acid and Ammonium sulfate
|98% Sulfuric acid and Ammonium sulfate
|98% Sulfuric acid and Hydrogen peroxide 4:1 add H<sub>2</sub>O<sub>2</sub> to H<sub>2</sub>SO<sub>4</sub>
|98% Sulfuric acid and Hydrogen peroxide 4:1 add H<sub>2</sub>O<sub>2</sub> to H<sub>2</sub>SO<sub>4</sub>
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|'''Process temperature'''
|'''Process temperature'''
|80 <sup>o</sup>C
|80 <sup>o</sup>C
 
|80 <sup>o</sup>C
|~70 <sup>o</sup>C the chemicals will heat up to working temperature during mixing, '''therefore be careful!'''First ad H2SO4 then H2O2
|~70 <sup>o</sup>C the chemicals will heat up to working temperature during mixing, '''therefore be careful!'''First ad H2SO4 then H2O2
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
|'''Process time'''
|'''Process time'''
|
|10 min.
10 min.
|10 min.
|
|10 min.
10 min.
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
|'''Allowed materials'''
|'''Allowed materials'''
|
|
Dependent on which bath is used, look at the text in the pictures.
*Silicon
*Poly Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Quartz/fused silica
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*Silicon
*Poly Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Quartz/fused silica
*Pyrex
*Soda lime glass
*Wafers with Cr
|
|
All materials (in beaker).
All materials (in beaker).

Revision as of 11:07, 3 March 2014

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Cleaning of wafers or masks

Cleaning of wafers or masks with sulphuric acid can be done either in a dedicated tank "7-up" or in the fume hood in a beaker "Piranha" Both 7-up and Piranha removes heavy organics. Always use one of these after KOH to remove alkali ions before further processing. 7-up and Piranha are also used as cleaning solutions after stripping resist.

7-up 6" in cleanroom D3. <br\> -Up to 25 wafers of 4" or 6" at a time.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi
7-up for masks and glass wafers positioned in cleanroom D3:<br\> -Up to 25 glass wafers of 4" at a time or 4 masks.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi, glass, chromium
7-up 4": positioned in cleanroom C1<br\> -Up to 19 wafers of 4" at a time.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi

Comparing data for "7-up" and Piranha

7-up wafers 7-up Masks Piranha
General description

Cleaning of wafers using the dedicated tank in cleanroom D3.

Cleaning of masks using the dedicated tank in cleanroom D3.

Cleaning of wafers using a beaker in the fumehood in cleanroom B1. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the 7-up for wafers or masks.

Chemical solution 98% Sulfuric acid and Ammonium sulfate 98% Sulfuric acid and Ammonium sulfate 98% Sulfuric acid and Hydrogen peroxide 4:1 add H2O2 to H2SO4
Process temperature 80 oC 80 oC ~70 oC the chemicals will heat up to working temperature during mixing, therefore be careful!First ad H2SO4 then H2O2
Process time 10 min. 10 min. 10 min.
Allowed materials
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Quartz/fused silica
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Quartz/fused silica
  • Pyrex
  • Soda lime glass
  • Wafers with Cr

All materials (in beaker).

Batch size

1-19/25 4" wafers or 4 masks at a time

1-5 4" wafer at a time

Size of substrate

4-6" wafers

2-4" wafers