Specific Process Knowledge/Wafer cleaning/7-up & Piranha: Difference between revisions
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|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
! | ! 7-up wafers | ||
! 7-up Masks | |||
! Piranha | ! Piranha | ||
|- | |- | ||
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|'''General description''' | |'''General description''' | ||
| | | | ||
Cleaning of wafers | Cleaning of wafers using the dedicated tank in cleanroom D3. | ||
| | | | ||
Cleaning of wafers using a beaker in the fumehood in cleanroom B1. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the 7-up for wafers. | Cleaning of masks using the dedicated tank in cleanroom D3. | ||
| | |||
Cleaning of wafers using a beaker in the fumehood in cleanroom B1. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the 7-up for wafers or masks. | |||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
|'''Chemical solution''' | |'''Chemical solution''' | ||
|98% Sulfuric acid and Ammonium sulfate | |||
|98% Sulfuric acid and Ammonium sulfate | |98% Sulfuric acid and Ammonium sulfate | ||
|98% Sulfuric acid and Hydrogen peroxide 4:1 add H<sub>2</sub>O<sub>2</sub> to H<sub>2</sub>SO<sub>4</sub> | |98% Sulfuric acid and Hydrogen peroxide 4:1 add H<sub>2</sub>O<sub>2</sub> to H<sub>2</sub>SO<sub>4</sub> | ||
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|'''Process temperature''' | |'''Process temperature''' | ||
|80 <sup>o</sup>C | |80 <sup>o</sup>C | ||
|80 <sup>o</sup>C | |||
|~70 <sup>o</sup>C the chemicals will heat up to working temperature during mixing, '''therefore be careful!'''First ad H2SO4 then H2O2 | |~70 <sup>o</sup>C the chemicals will heat up to working temperature during mixing, '''therefore be careful!'''First ad H2SO4 then H2O2 | ||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
|'''Process time''' | |'''Process time''' | ||
| | |10 min. | ||
10 min. | |10 min. | ||
| | |10 min. | ||
10 min. | |||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
|'''Allowed materials''' | |'''Allowed materials''' | ||
| | | | ||
*Silicon | |||
*Poly Silicon | |||
*Silicon Oxide | |||
*Silicon Nitride | |||
*Silicon Oxynitride | |||
*Quartz/fused silica | |||
| | |||
*Silicon | |||
*Poly Silicon | |||
*Silicon Oxide | |||
*Silicon Nitride | |||
*Silicon Oxynitride | |||
*Quartz/fused silica | |||
*Pyrex | |||
*Soda lime glass | |||
*Wafers with Cr | |||
| | | | ||
All materials (in beaker). | All materials (in beaker). |
Revision as of 11:07, 3 March 2014
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Cleaning of wafers or masks
Cleaning of wafers or masks with sulphuric acid can be done either in a dedicated tank "7-up" or in the fume hood in a beaker "Piranha" Both 7-up and Piranha removes heavy organics. Always use one of these after KOH to remove alkali ions before further processing. 7-up and Piranha are also used as cleaning solutions after stripping resist.
Comparing data for "7-up" and Piranha
7-up wafers | 7-up Masks | Piranha | |
---|---|---|---|
General description |
Cleaning of wafers using the dedicated tank in cleanroom D3. |
Cleaning of masks using the dedicated tank in cleanroom D3. |
Cleaning of wafers using a beaker in the fumehood in cleanroom B1. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the 7-up for wafers or masks. |
Chemical solution | 98% Sulfuric acid and Ammonium sulfate | 98% Sulfuric acid and Ammonium sulfate | 98% Sulfuric acid and Hydrogen peroxide 4:1 add H2O2 to H2SO4 |
Process temperature | 80 oC | 80 oC | ~70 oC the chemicals will heat up to working temperature during mixing, therefore be careful!First ad H2SO4 then H2O2 |
Process time | 10 min. | 10 min. | 10 min. |
Allowed materials |
|
|
All materials (in beaker). |
Batch size |
1-19/25 4" wafers or 4 masks at a time |
1-5 4" wafer at a time | |
Size of substrate |
4-6" wafers |
2-4" wafers |