Specific Process Knowledge/Wafer cleaning/7-up & Piranha: Difference between revisions

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{| border="2" cellspacing="0" cellpadding="4" align="left" width="570pt"
{| border="2" cellspacing="0" cellpadding="4" align="left" width="570pt"
|-style="background:silver; color:black"
!  
!  
! "7-up"
! "7-up"
! Piranha
! Piranha
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|-style="background:WhiteSmoke; color:black"
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|'''General description'''
|'''General description'''
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Cleaning of wafers using a beaker in the fumehood in cleanroom B1. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the 7-up for wafers.
Cleaning of wafers using a beaker in the fumehood in cleanroom B1. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the 7-up for wafers.
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|-
|-style="background:LightGrey; color:black"
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|'''Chemical solution'''
|'''Chemical solution'''
|98% Sulfuric acid and Ammonium sulfate
|98% Sulfuric acid and Ammonium sulfate
|98% Sulfuric acid and Hydrogen peroxide 4:1 add H<sub>2</sub>O<sub>2</sub> to H<sub>2</sub>SO<sub>4</sub>
|98% Sulfuric acid and Hydrogen peroxide 4:1 add H<sub>2</sub>O<sub>2</sub> to H<sub>2</sub>SO<sub>4</sub>
|-
|-
|-style="background:WhiteSmoke; color:black"
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|'''Process temperature'''
|'''Process temperature'''
|80 <sup>o</sup>C
|80 <sup>o</sup>C
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|~70 <sup>o</sup>C the chemicals will heat up to working temperature during mixing, '''therefore be careful!'''First ad H2SO4 then H2O2
|~70 <sup>o</sup>C the chemicals will heat up to working temperature during mixing, '''therefore be careful!'''First ad H2SO4 then H2O2
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|-
|-style="background:LightGrey; color:black"
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|'''Process time'''
|'''Process time'''
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10 min.
10 min.
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|'''Allowed materials'''
|'''Allowed materials'''
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All materials (in beaker).
All materials (in beaker).
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|-
|-style="background:LightGrey; color:black"
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|'''Batch size'''
|'''Batch size'''
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1-5 4" wafer at a time
1-5 4" wafer at a time
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|-style="background:WhiteSmoke; color:black"
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|'''Size of substrate'''
|'''Size of substrate'''
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Revision as of 10:59, 3 March 2014

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Cleaning of wafers or masks

Cleaning of wafers or masks with sulphuric acid can be done either in a dedicated tank "7-up" or in the fume hood in a beaker "Piranha" Both 7-up and Piranha removes heavy organics. Always use one of these after KOH to remove alkali ions before further processing. 7-up and Piranha are also used as cleaning solutions after stripping resist.

7-up 6" in cleanroom D3. <br\> -Up to 25 wafers of 4" or 6" at a time.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi
7-up for masks and glass wafers positioned in cleanroom D3:<br\> -Up to 25 glass wafers of 4" at a time or 4 masks.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi, glass, chromium
7-up 4": positioned in cleanroom C1<br\> -Up to 19 wafers of 4" at a time.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi

Comparing data for "7-up" and Piranha

"7-up" Piranha
General description

Cleaning of wafers or masks using the dedicated tanks. There are one tank for masks and glass wafers and one for 4-6" Si wafers in cleanroom D3 and one tank in cleanroom C1 for 4" Si wafers only.

Cleaning of wafers using a beaker in the fumehood in cleanroom B1. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the 7-up for wafers.

Chemical solution 98% Sulfuric acid and Ammonium sulfate 98% Sulfuric acid and Hydrogen peroxide 4:1 add H2O2 to H2SO4
Process temperature 80 oC ~70 oC the chemicals will heat up to working temperature during mixing, therefore be careful!First ad H2SO4 then H2O2
Process time

10 min.

10 min.

Allowed materials

Dependent on which bath is used, look at the text in the pictures.

All materials (in beaker).

Batch size

1-19/25 4" wafers or 4 masks at a time

1-5 4" wafer at a time

Size of substrate

4-6" wafers

2-4" wafers