Specific Process Knowledge/Wafer cleaning: Difference between revisions
| Line 42: | Line 42: | ||
|Mandatory prior furnace processes | |Mandatory prior furnace processes | ||
|When needed and always after KOH etch and Nitride etch in Phosphoric acid | |When needed and always after KOH etch and Nitride etch in Phosphoric acid | ||
|Optional | |Optional during RCA cleaning | ||
|Cleaning before wafer bonding | |Cleaning before wafer bonding | ||
|Cleaning very dirty items that enters the cleanroom. Should be followed by a piranha clean. | |Cleaning very dirty items that enters the cleanroom. Should be followed by a piranha clean. | ||