Specific Process Knowledge/Etch/Wet Aluminium Etch: Difference between revisions
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Ething of Aluminium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with the [[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch]] using Chlorine chemistry or with [[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE]] by sputtering with Ar ions. | Ething of Aluminium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with the [[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch]] using Chlorine chemistry or with [[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE]] by sputtering with Ar ions. | ||
=Wet Aluminium Etch= | |||
[[Image:BHF-PolySi-Al-etch.JPG|300x300px|thumb|Wet Aluminium Etch: Positioned in cleanroom D-3 to the right in the bench]] | [[Image:BHF-PolySi-Al-etch.JPG|300x300px|thumb|Wet Aluminium Etch: Positioned in cleanroom D-3 to the right in the bench]] | ||
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=68 Al-etch info page in LabManager] | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=68 Al-etch info page in LabManager] | ||
==Comparing the two solutions== | |||
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