Specific Process Knowledge/Lithography/Baking: Difference between revisions
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==120 C 4" hotplate== | ==120 C 4" hotplate== | ||
[[Image:Hotplate_120_degrees_cr3.jpg|200x200px|thumb|Hotplate 120 degrees: positioned in | [[Image:Hotplate_120_degrees_cr3.jpg|200x200px|thumb|Hotplate 120 degrees: positioned in C-1]] | ||
120 deg. hotplate is used for 2 different things, hard bake of resist and image reversal baking between two exposure. It is recommended to hard bake for 2 min. for image reversal it is recommended at least 100 sec. some bake at 120 sec. | 120 deg. hotplate is used for 2 different things, hard bake of resist and image reversal baking between two exposure. It is recommended to hard bake for 2 min. for image reversal it is recommended at least 100 sec. some bake at 120 sec. | ||
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==SU8 hotplates== | ==SU8 hotplates== | ||
[[Image:su8_bench.jpg|200x200px|thumb|SU-8 bench in | [[Image:su8_bench.jpg|200x200px|thumb|SU-8 bench in C-1]] | ||
We have four dedicated SU-8 hotplates in CR3. | We have four dedicated SU-8 hotplates in CR3. | ||
Users can control the ramp-time, time and temperature. | Users can control the ramp-time, time and temperature. | ||