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Specific Process Knowledge/Lithography/UVLithography: Difference between revisions

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|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
|'''AZ5214E'''
|'''AZ 5214E'''
|Positive but can be reverse
|Positive but can be reversed
|[http://www.azem.com/en/Products/Litho-technology/Photoresists.aspx AZ Electronic Materials]
|[http://www.azem.com/en/Products/Litho-technology/Photoresists.aspx AZ Electronic Materials]
|Can be used for both positive and reverse processes with resist thickness between 1 to 4um.
|Can be used for both positive and reverse processes with resist thickness between 1 to 4um.
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|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
|'''AZ4562'''
|'''A 4562'''
|Positive
|Positive
|[http://www.azem.com/en/Products/Litho-technology/Photoresists.aspx AZ Electronic Materials]
|[http://www.azem.com/en/Products/Litho-technology/Photoresists.aspx AZ Electronic Materials]
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|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
|'''SU8'''
|'''SU-8'''
|Negative
|Negative
|[http://microchem.com/Prod-SU82000.htm Microchem]
|[http://microchem.com/Prod-SU82000.htm Microchem]
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|[[media:SU-8_DataSheet_2005.pdf‎|SU-8_DataSheet_2005.pdf‎]], [[media:SU-8_DataSheet_2075.pdf‎|SU-8_DataSheet_2075.pdf‎]]
|[[media:SU-8_DataSheet_2005.pdf‎|SU-8_DataSheet_2005.pdf‎]], [[media:SU-8_DataSheet_2075.pdf‎|SU-8_DataSheet_2075.pdf‎]]
|[[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]]
|[[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]]
|PGMEA, Mr60 developer
|PGMEA, mr-Dev 600 developer
|IPA
|IPA
|Plasma ashing can remove crosslinked SU8.
|Plasma ashing can remove crosslinked SU8.