Specific Process Knowledge/Etch/Wet Titanium Etch

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Ething of Titanium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with ICP using Chlorine chemistry or with IBE by sputtering with Ar ions.

Wet etching of Titanium

Fume hood in cleanroom B-1.
Wet Etch of Titanium can take place in this pp tank or in a beaker in this fume hood

We have two solutions for wet titanium etching:

1. BHF
2. Cold RCA1

Do it by making your own set up in a beaker in a fume hood - preferably in cleanroom B-1 or D-3. You can see the APV here. BHF etching can also take place in the PP-etch bath in the fume hood in cleanroom B-1.

Comparing the two solutions

	BHF	Cold RCA1
General description	Etch of titanium with or without photoresist mask.	Etch of titanium (as stripper or with eagle resist).
Link to safety APV and KBA	see APV here see KBA here	see APV here
Chemical solution	HF:NH4F	NH3OH:H2O2:H2O - 1:1:5
Process temperature	Room temperature	Room temperature
Possible masking materials	Photoresist (1.5 µm AZ5214E)	Eagle resist
Etch rate	Not known (it bubbles while etching)	Not known
Batch size	1-5 4" in beaker 1-25 wafers at a time in PP-etch bath	1-5 4" wafer at a time
Size of substrate	Any size and number that can go inside the beaker in use.	Any size and number that can go inside the beaker in use.
Allowed materials	No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2. Make a note on the beaker of which materials have been processed.	No restrictions when used in beaker. Make a note on the beaker of which materials have been processed.