Specific Process Knowledge/Etch/Wet Silicon Nitride Etch: Difference between revisions
| Line 11: | Line 11: | ||
'''NB: Great care has to be taken in this process due to risk of "shock-boiling" ''' | '''NB: Great care has to be taken in this process due to risk of "shock-boiling" ''' | ||
'''The user manual, user APV and contact information can be found in LabManager:''' | '''The user manual, user APV and contact information can be found in LabManager:''' | ||
<!-- remember to remove the type of documents that are not present --> | <!-- remember to remove the type of documents that are not present --> | ||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=130 Nitride etch info page in LabManager], | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=130 Nitride etch info page in LabManager], | ||