Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300: Difference between revisions
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This Ionfab300 from Oxford Instruments is capable of of both ion sputter etching/milling and sputter deposition. | This Ionfab300 from Oxford Instruments is capable of of both ion sputter etching/milling and sputter deposition. | ||
The etching/milling with Argon alone is done by pure physical sputtering of the surface. This causes redeposition on the sidewalls leaving side wall angles at typically between 70-90 degrees (often closest to 70 degrees). | The etching/milling with Argon alone is done by pure physical sputtering of the surface. This causes redeposition on the sidewalls leaving side wall angles at typically between 70-90 degrees (often closest to 70 degrees). | ||
'''The user manual and contact information can be found in LabManager:''' | |||
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=326 IBE/IBSD Ionfab 300+ in LabManager] | |||
==Process information== | ==Process information== | ||