Specific Process Knowledge/Characterization: Difference between revisions
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*[[/SEM: Scanning Electron Microscopy | *[[/SEM: Scanning Electron Microscopy |SEM FEI]] | ||
*[[/SEM: Scanning Electron Microscopy | *[[/SEM: Scanning Electron Microscopy |SEM LEO]] | ||
*[[/SEM: Scanning Electron Microscopy | *[[/SEM: Scanning Electron Microscopy |SEM JEOL]] | ||
*[[/SEM: Scanning Electron Microscopy | *[[/SEM: Scanning Electron Microscopy |SEM Zeiss]] | ||
*[[/SEM: Scanning Electron Microscopy | *[[/SEM: Scanning Electron Microscopy |SEM Zeiss Supra 60 VP]] | ||
*[[/AFM: Atomic Force Microscopy|Nanoman - ''Atomic Force Microscopy'']] | *[[/AFM: Atomic Force Microscopy|Nanoman - ''Atomic Force Microscopy'']] | ||
Revision as of 14:20, 20 February 2014
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Choose characterization topic
- Sample imaging
- Topographic measurement
- Stress measurement
- Measurement of film thickness and optical constants
- Wafer thickness measurement
- Element analysis
- Contact angle measurement
- Four-Point_Probe (Resistivity measurement)
- Carrier density (doping) profiler
- Scanning Electron Microscopy