Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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==HMDS oven== | ==HMDS oven== | ||
[[Image:HMDS1.JPG|300x300px|thumb|The HMDS oven is placed in Cleanroom | [[Image:HMDS1.JPG|300x300px|thumb|The HMDS oven is placed in Cleanroom C-1.]] | ||
At Danchip we use Star2000 model from IMTEC to do vapor deposition of hexamethyldisilizane (HMDS) under the special conditions: low pressure and high chamber temperature. The result of the dehydration bake and HMDS prime is that the wafers become hydrophobic after the treatment. | At Danchip we use Star2000 model from IMTEC to do vapor deposition of hexamethyldisilizane (HMDS) under the special conditions: low pressure and high chamber temperature. The result of the dehydration bake and HMDS prime is that the wafers become hydrophobic after the treatment. | ||