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Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions

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'''Feedback to this section''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Pretreatment#HMDS click here]'''
'''Feedback to this section''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Pretreatment#HMDS click here]'''


The chemical treatment with hexamethyldisilazane (HMDS) before the spin coating can be used to promote the adhesion for photoresist. HMDS treatment leaves a mono-layer of TMS (trimethylsilyl) on the Si or SiO<sub>2</sub> surface.
The chemical treatment with hexamethyldisilazane (HMDS) before the spin coating can be used to promote the adhesion for photoresist. Vapor priming with HMDS leaves a mono-layer of TMS (trimethylsilyl) on the Si or SiO<sub>2</sub> surface.


The molecular formula for hexamethyldisilazane, or bis(trimethylsilyl)amine, is C<sub>6</sub>H<sub>19</sub>NSi<sub>2</sub>. Here is a schematic overview of HMDS treatment of silicon-oxide surface.
The molecular formula for hexamethyldisilazane, or bis(trimethylsilyl)amine, is C<sub>6</sub>H<sub>19</sub>NSi<sub>2</sub>. Here is a schematic overview of HMDS treatment of silicon-oxide surface.
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