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Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,527 edits
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!Possible masking materials
!Chemical
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*Photoresist
HMDS
*PolySilicon
*Silicon nitride (LPCVD)
*Blue film
*Cr/Au for deeper etches (plastic beaker)
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*Photoresist
HF
*DUV resist
*E-beam resist
*Silicon Oxide
*Silicon Nitride
*Metals if they cover less than 5% of the wafer area (ONLY RIE2!)
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*Photoresist
none
*DUV resist
*E-beam resist
*Silicon Oxide
*Silicon Nitride
*Aluminium
*Chromium (Please try to avoid this)
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