Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions
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In the case of the silicon etching on the ASE, an etch phase with SF<sub>6</sub> and O<sub>2</sub> alternates with a passivation phase with C<sub>4</sub>F<sub>8</sub>. | In the case of the silicon etching on the ASE, an etch phase with SF<sub>6</sub> and O<sub>2</sub> alternates with a passivation phase with C<sub>4</sub>F<sub>8</sub>. | ||
'''The user manual, quality control procedure and results, user APV(s), technical information and contact information can be found in LabManager:''' | |||
Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=105| LabManager] | |||
Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach= | |||
==Process information== | ==Process information== | ||