Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. | The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. | ||
'''The user manual(s) | '''The user manual(s), user APV(s), technical information and contact information can be found in LabManager:''' | ||
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