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Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,579 edits
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|style="background:LightGrey; color:black"|Etch rates
|style="background:LightGrey; color:black"|Etch rates
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon: ~4-6 µm/min (depending on features size and etch load)
*Silicon: ~4-15 µm/min (depending on features size and etch load)
|-
|-
|style="background:LightGrey; color:black"|Anisotropy
|style="background:LightGrey; color:black"|Anisotropy
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