Specific Process Knowledge/Back-end processing: Difference between revisions

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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.


These processes are usually carried out a number of different places at DTU Danchip. At Danchip we also have a laboratory called PackLab located in building 347 1.st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1.st floor in building 346.
These processes are usually carried out a number of different places at DTU Danchip. At Danchip we also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.


Below you can see a list of equipment for back-end processing that is available at DTU Danchip.  
Below you can see a list of equipment for back-end processing that is available at DTU Danchip.  

Revision as of 14:51, 6 February 2014

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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places at DTU Danchip. At Danchip we also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Below you can see a list of equipment for back-end processing that is available at DTU Danchip.

Choose an equipment

Choose processing method

Lapping/polishing Cutting Milling Die bonding Wire bonding

Choose material to be processed

Dielectrica Semiconductors Metals Polymers
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