Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
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*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN) | *Typical materials are: Alumina (Al2O3), AluminumNitride (AlN) | ||
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*Any that is compatible with the glue used | *Any that is compatible with the glue and temperature used | ||
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