Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

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== Die bonder (eutectic metal soldering) ==
== Die bonder (eutectic metal soldering) ==
[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|right|thumb|The Die-bonder Cammax EDB-80]]


The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  


'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''  
'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''  
<!-- remember to remove the type of documents that are not present -->
<!-- remember to remove the type of documents that are not present -->
[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|right|thumb|The Die-bonder Cammax EDB-80]]


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Revision as of 15:33, 5 February 2014

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Die bonder (eutectic metal soldering)

The Die-bonder Cammax EDB-80

The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

The user manuals, user APVs, technical information and contact information can be found in LabManager:

Die Bonder in LabManager

Process information

Flip-chip bonder (glue attachment)

The Flip chip bonder

The flip chip bonder can be used to place chips on a substrate with high precision. This way electrical contacts can be made between chip and substrate. With a dispensing tool small amounts of solder paste or glue is dispensed on the substrate with high accuracy. The substrate could for example be a printed circuit board (PCB). After some experience with the machine, it is possible to place dots with different shapes and sizes on the surface. With a placement tool a chip can then be picked up upside down and by the use of the camera unit, it is possible to align the contacts on the chip with the solder/glue dots on the contacts on the substrate before joining the two surfaces with a light pressure. The stack is cured and an underfill glue can be dispensed to enhance the bonding strength between chip and substrate.

The user manuals, user APVs, technical information and contact information can be found in LabManager:

Flip-chip Bonder in LabManager

Equipment performance and process related parameters

Equipment Die bonder Flip-chip bonder
Purpose
  • Fine placement of dies
  • Eutectic metal soldering
  • Fine placement of dies
  • glue attachment
Performance
  • Low thermal resistance
  • Always conducting
  • Medium or High thermal resistance
  • Possibility of both conducting and isolating adhesives
  • If an epoxy based adhesive is used the user is required to have the epoxy course.
Substrates Allowed materials
  • Should be able to withstand the soldering temperature
  • Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
  • Any that is compatible with the glue used


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