Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions

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 {| border="2" cellspacing="0" cellpadding="2"
-!colspan="2" border="none" style="background:silver; color:black;" align="center"|Spin Track
+!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
-|style="background:WhiteSmoke; color:black" align="center"|<b>1</b>
+|style="background:WhiteSmoke; color:black" align="center"|<b>HMDS oven</b>
-|style="background:WhiteSmoke; color:black" align="center"|<b>2</b>
+|style="background:WhiteSmoke; color:black" align="center"|<b>Spin Track 1 + 2</b>
 |-
 !style="background:silver; color:black;" align="center" width="60"|Purpose
 |style="background:LightGrey; color:black"|
 |style="background:WhiteSmoke; color:black"|
-*HMDS priming
+* HMDS priming
+* Dehydration of substrates
 |style="background:WhiteSmoke; color:black"|
-*HMDS priming
+* HMDS priming only
+* HMDS proming and spin coating
 |-
 !style="background:silver; color:black;" align="center" width="60"|Priming chemical